Small Magnetron Sputtering R&D Equipment
Precision research sputtering with full parameter accessibility
System Overview
The HN-MS-R-007 is a research-grade magnetron sputtering platform built for thin-film research and process development in academic, semiconductor, and optical technology laboratories. Supporting multiple sputtering configurations — including co-sputtering and sequential deposition — the system provides the parameter range and in-situ measurement options expected of a premier research tool.
Working Principle
Planar or confocal magnetron sputtering sources enable DC, RF, and pulsed-DC operation across a wide range of metallic, ceramic, and compound target materials. The research-oriented design prioritizes measurement access, flexible geometry, and compatibility with analytical instruments.
Core Advantages
- Multi-target configuration for co-sputtering and alloy film development
- DC, RF, and pulsed-DC source options for conductive and insulating targets
- In-situ RHEED, QCM, or optical monitoring integration ports
- UHV-compatible chamber design for contamination-sensitive research
- Substrate temperature control from ambient to 800 °C
- Multiple gas inlet channels for reactive and mixed-atmosphere studies
- Compatible with standard 2-inch and 3-inch wafer substrates
Technical Specifications
| Chamber | φ400/500 mm chamber |
|---|---|
| Targets | 2–4 planar magnetron targets with DC/RF power |
| Power Control | Independent target power adjustment with co-sputtering support |
| Temperature Control | Ambient to 800 °C; programmable 1–20 °C/min ramp rate |
| Thickness Monitoring | Real-time QCM thickness recording |
| Data System | Independent sample records with one-click experiment-curve export |
Specifications are representative. Final system parameters are defined during configuration. Contact our engineering team for detailed documentation.
